- Migration from Winbond W25Qxx 3.0-V SPI to Cypress S25FL1-K 3.0-V SPI www.cypress.com Document No.B 3 4 8-Pin and 16-Pin SOIC, and 8-Contact WSON Signal Pin Assignments Signal pin assignments are identical for both 8-pin SOIC and 16-pin SOIC, as well as the 8-contact WSON package.
- Winbond Electronics Corporation was founded in September 1987,dedicated to advanced semiconductor deign and production technology, providing customers with special specifications of memory solutions. An extensive product line of Winbond Electronics is available at WIN SOURCE, especially for Winbond Electronics’s obsolete & end-of-life.
- Full Name : Winbond Electronics Corporation America Manufacturer
- Site : www.winbond-usa.com
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Winbond Electronics Corporation was established in September, 1987. The main business groups of Winbond include: DRAM Product, NOR Flash and Memory IC Manufacturing. Winbond headquarters in Central Taiwan Science Park, Taiwan and subsidies in America, Japan, and Hong Kong. As the Memory IC Company of excellence, Winbond strives to provide customer-driven memory solutions backed by the expert capabilities of product design, technology R&D, manufacturing, and sales services.Parts Catalog - Winbond - 16Mb x16 CRAM 16Mb x16 CRAM-ADM 2Mb x16 CRAM 2Mb x16 CRAM-ADM 4Mb x16 CRAM 4Mb x16 CRAM-ADM 8Mb x16 CRAM 8Mb x16 CRAM-ADM. Rambus announced that Winbond Electronics Corporation has licensed Rambus Cryptography Research differential power analysis, or DPA countermeasures to protect industry-leading, flash memory components. By implementing Cryptography Research DPA countermeasures, Winbond ensures the data integrity of products that run applications requiring a high level of security, including mobile payments. Winbond W25Q16DV supports both 32-kB block erase and 64-kB block erase, while Cypress S25FL116K supports 64-kB block erase only. 2.3 Program Method Both Winbond W25Q16DV and Cypress S25FL116K support page program with program length from 1 to 256 bytes. W25Q16DV supports Quad Page-Program, while S25FL116K does not. 2.4 Multi-I/O Operation.
Winbond provides its partners with high-quality foundry services; meanwhile, manufactures Specialty DRAM, Mobile Memory and Flash Memory which are marketed under its own corporate brand name. With the optimizations of cost structure and capacity allocation, Winbond keeps pace with the latest technologies through good collaborations with international partners, ceaselessly achieves the long-term profitability and stable growth for the corporation. Professionalism and innovation are the main goals that Winbond continues pursuing.At the same time, Winbond provides comprehensive training courses, a continuously improving employee-benefit system, and employment opportunities based on performance. Winbond received the Friendly Workplace Award from the Executive Yuan’s Council of Labor Affairs in Taiwan.
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Winbond is product portfolio consists of NOR Flash, SLC NAND Flash, mobile SRAM, dedicated DRAM.
Consumer Electronics / Communication / Network / Transportation / Automotive / Industrial / Automation
- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in peonal injury. Winbond custome using or selling these products for use in such applicatio do so at their own risk and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
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MoreType | Corporation |
---|---|
Industry | Semiconductors |
Founded | 1987; 34 years ago |
Headquarters | Taiwan |
Arthur Yu-Cheng Chiao (Chairman & CEO) Tung-Yi Chan (President) | |
Products |
|
Website | www.winbond.com |
Winbond Electronics Corporation (Chinese: 華邦電子公司; pinyin: Huábāng Diànzǐ Gōngsī) is a Taiwan-based corporation founded in 1987. It produces semiconductors and several types of integrated circuits, most notably Dynamic RAM, Static RAM, Serial flash, microcontrollers, and personal computerICs, namely Super I/O chips. Winbond is currently the largest brand name integrated circuit supplier in Taiwan, and one of the biggest suppliers of semiconductor solutions worldwide.
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Computer IC, Consumer Electronics IC, and Logic Product Foundry of Winbond product lines have been spun off as Nuvoton Technology Corporation on 1 July 2008.